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Micro Machining and Bonding Prototyping and Low-volume Manufacturing Services

Mitsubishi Heavy Industries Machine Tool offers prototyping and Low-volume Manufacturing services using room temperature wafer bonding machines and laser micromachining systems.

Please feel free to contact us if you would like to:

  1. try to apply the technology to your product;
  2. use the technology as a research tool;
  3. compare the technology to other machining technologies for consideration;
  4. prototype specific parts, or;
  5. have a certain volume of parts processed on a monthly basis without introducing the machine.

Service machine


Room Temperature Wafer Bonding Machine BOND MEISTER

SiC / Si

SiC / Si

Laser Micromachining System ABLASER

Borosilicate glass Helical Milling

Borosilicate glass Helical Milling
Thickness: 0.8 mm

Stainless Helical Milling 1

Stainless Helical Milling
Thickness: 0.5 mm
Groove width:0.05mm

Stainless Helical Milling 2
Stainless Helical Milling 3