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Laser Micromachining System ABLASER

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Laser Micromachining System ABLASER
ABLASER-DUV ABLASER

outline

・High quality machining is achieved by the short pulse laser ablation method (high energy beam focused in a very short period of time).
・There are two types of machine based on different laser
 (1)Green laser (second harmonic of YAG laser)
 (2)DUV laser (Fourth harmonic of YAG laser)
・Various materials such as ceramics, optical materials, dielectric materials, metals and other semiconductor materials can be machined.

Principle of machining

Irradiation with a short-pulse (picosecond) laser beam causes the targeted part to be ablated, thereby enabling machining with minimum thermal effect compared with conventional nanosecond laser irradiation.
This new technology prevents the alteration, deformation or sputtering of the target material, providing sharp edges and excellent inner surface roughness that have never been achieved before.

Features

New optical head using proprietary technology to achieve high-precision helical drilling

The optical head uses our proprietary technology that adjusts the laser beam to the desired hole diameter and irradiates a pulse laser while allowing it to rotate at high speed. This achieves the high-precision, high-efficiency machining of straight holes as well as any type of tapered hole.
Schematic diagram of helical machining
Schematic diagram of helical machining
Result of cutting test on silicon material
Result of cutting test on silicon material
ABLASERのヘリカル加工の模式図
Straight hole
ABLASERのヘリカル加工の模式図
reverse tapered hole
ABLASERのヘリカル加工の模式図
hourglass-shaped hole

Applicable to various materials including semiconductor materials

Silicon group: Silicon (Si), Silicon oxide (SiO2), Silicon Nitride (SiN)
Compound semiconductor: Silicon carbide (SiC)
Optical materials: Various types of glass, fused silica, Crystal, Sapphire
Dielectric materials: Lithium tantalate (LiTaO3), Lithium niobate (LiNbO3)
Ceramics: Silicon nitride (SiN), Aluminum Oxide (Al2O3)
Metals: Stainless steel, Hardened steel, cemented carbide, Copper

Bonded materials can be machined at once.

Bonded materials such as Lithium Tantalate on Silicon (LT/Si) can be machined at once.
A unique method based on our experience of Room-temperature wafer bonding.

Application area

■Via hole machining(TSV、TGV)
■Probe card
■Bonded materials such as bonded wafer
■Hard-to-cut materials machining
■Ceramics machining
■High accuracy micro die such as green sheet die

Machining examples

Silicon micro hole machining

Material: Silicon wafer
Diameter: 0.15 mm
Thickness: 0.5 mm
Machining time: 9.0sec./hole

SiC micro hole machining

Material: Machinable ceramics
Diameter: 0.06mm
Thickness: 0.6 mm
Machining time: 5sec./hole

Machinable ceramics micro hole machining

Material: Machinable ceramics
Diameter: 0.06mm
Thickness: 0.6 mm
Machining time: 5sec./hole

Platinum machining by helical milling

Material: platinum
Diameter: 2.0 mm
thickness: 1.5 mm
Machining time: 4min/hole

Lithium Tantalate DUV machining

Material: Lithium Tantalate
Diameter : 0.027 mm
Thickness : 0.35 mm
Aspect ratio: 13

Lithium Tantalate

Bonded wafer of Lithium Tantalate and Silicon DUV machining

Materials: Lithium Tantalate/ Silicon
Diameter : 0.020 mm
Thickness : 0.20 mm
Aspect ratio: 10


Bonded wafer of Lithium Tantalate and Silicon
A unique process proposal is possible by us as a manufacturer of both Wafer Bonder and ABLASER.
This process realizes highly efficient machining of holes through two materials at once. Also Note the hole size is 20μm.

Bonded wafer of monocrystalline SiC and Silicon DUV machining

Material: SiC/ Si
Diameter : 0.020 mm
Thickness : 0.20 mm
Aspect ratio : 10

Bonded wafer of monocrystalline SiC and Silicon

Square holes on stainless steel DUV machining

Material : stainless steel
Hole size : □0.04 mm
Thickness : 0.30 mm

Square holes on stainless steel
Enables sharp edge machining comparing to etching process.
Laser machining process can do away with complicated lithography process of etching.
It can be applied to both metals or brittle materials.

Groove machining on borosilicate glass DUV

Groove width: 0.03mm
Groove depth: 0.03 mm

Groove width: 0.01mm
Groove depth: 0.03 mm

Specification

■Machine specifications

Item Specifications Remarks
ABLASER ABLASER-DUV
Stroke X axis(mm) 300 Precision scale provided as standard
Stroke Y axis (mm) 200 Precision scale provided as standard
Stroke Z axis (mm) 100 Precision scale provided as standard
Positioning accuracy(mm) ±0.002
Maximum feed rate(m/min) 10
NC system FANUC 31iB
Maximum output power 30W 2W
Wave length (nm) 515 266
Laser head Proprietary product
Machinable size (mm) φ0.05~0.3 φ0.01~0.3
Tapered hole control Forward/reverse-tapered
andhourglass-shaped
Assist gas Can select for the specific
target materials
Width×Depth×
Height(mm)
2,040×2,590×2,220 Machine body only(Control panel and accessories not included)
Weight 5.0t Machine body only(Control panel and accessories not included)
Fume collector included
Internal ventilation
X/Y/Z axis bellows Heat-resistant To 400℃ (750°F)
contact Trial production services
Business contact: Strategic Sales Operation Department
Phone: +81-77-501-3822
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