The DUV laser is an acronym for a Deep UltraViolet laser by the fourth harmonic generation (with a wavelength of 266 nm).
ABLASER-DUVs are equipped with a high-quality short-pulse DUV laser oscillator and a lens & prism suitable for the DUV laser in combination with our unique optical head that can quickly and accurately rotate the laser beam, enabling high-precision, high-quality micromachining.
Various types of laser beams depending on the wavelengths
Minimum machining diameter of 10µm and maximum aspect ratio of 10
The use of the 266 nm short wavelength laser makes it possible to achieve a smaller focal spot diameter, enabling finer machining. The minimum drilled hole diameter of ABLASER-DUV is 10 µm, substantially improved from 50 µm with the green laser ABLASER. In addition, the optimally designed laser optical system ensures a long focal depth, achieving the maximum aspect ratio of 10.
Even available for machining resistant materials
Since the DUV laser has high absorption through various materials and high light energy, the system exhibits high machining performance with materials such as glass and compound semiconductors that were previously hard to process.
Examples of machining
|Material||Stainless steel (SUS304)||Single crystal silicon carbide (SiC) wafer|
|X axis (mm)||300 (100) (Note 1)|
|Y axis (mm)||200 (100) (Note 1)|
|Z axis (mm)||100|
|C axis (°)||360|
|A axis (°)||-20～120|
|Positioning accuracy (mm)||0.001|
|Machinable size (mm)||φ0.01～|
|Tapered hole control||Forward/reverse-tapered and drum-shaped holes|
|Width x Depth x Height (mm)||2,040 x 2,620 x 2,000
Machine body only, control panel and accessories not included
(Note 1) The value within the parentheses indicates the travel with the A/C axis installed.